Warsaw Pack – 7th International Fair of Packaging Technology and Packaging
Ladies and Gentlemen, in connection with your participation as an exhibitor in the 7th edition of the International Fair of Packaging Technology and Packaging, we would like to thank you for visiting our stand. We are very pleased that the stand prepared by us aroused great interest on your part.
We would like to emphasize that the Warsaw Pack Fair was an excellent opportunity to present, among others, our latest product ZigZag Delux paper chips and meetings with our clients and partners.
We would also like to invite you to the next edition next year!
